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reduces porosity and hygrometric shrinkage
Its optimised formulation makes it suitable for use in both commercial and residential environments
Floor Coverings: Cemfloor Level Plus is compatible with all floor coverings and cementitious adhesives
hardwood flooring
Renoscreed HI-Bond Red 12kg (2 part curing agent & base) Bonding Agents reduces porosity and hygrometric shrinkageRenoscreed Hi Bond Solvent Free Epoxy Primer and Damp Proof Membrane for Maximum Screed Adhesion Renoscreed Hi Bond is a high performance, two component epoxy resin system designed for use as both a bonding primer and a surface damp proof membrane (DPM). Formulated to deliver exceptional mechanical and chemical adhesion, it is ideal for preparing concrete and cementitious substrates ahead of screed applicationespecially where moisture control or high
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